Germany to high heat gun manufacturers to introduce the development of micro welding technology:

In twenty-first Century, electronic product assembly welding micro welding has entered into the era, directly reflects the microelectronic products on the market more and more thin, fine, portable, multifunctional, and electronics micro welding process is a key factor affecting the quality and reliability of electronic products downstream.

Due to limited space, the welding between electronic components pin spacing is slight, the millimeter level welding welding has been not used in fine pitch, subtle electronic development has higher requirements for welding, assembly density to high density assembly direction, the installation of components will reduce the distance from 0.15mm to 0.1mm, also in the development of assembly from 2D to 3D assembly direction. These changes require soldering technology to change, to adapt to the development trend of the electronic market, the micro electron. Electronic parts micro welding technology will be developed in the following aspects: laser micro welding, micro welding, visual positioning identification technology, welding operation system, etc.. These techniques can be reflected in the process of module form integration in precision soldering robot or robot unit automatic production line.

With the rapid development of microelectronic technology and the application of large scale integrated circuit, the development of micro assembly technology urgently needs the process optimization method suitable for batch production and batch production. The automatic production of efficient production, convenient operation etc. also requires balanced production activities, improve the analysis on the production progress and product quality timely, effectively maintain the collaboration between different devices and soldering robot automation production.